Unique innovations have made Juki a technology leader in the SMT industry for over 15 years. Based on this wide experience our customers are guaranteed extreme reliability with each production platform. Combined with outstanding accuracy and placement rates our machines are suited for all future applications. Each Juki placement module is an important investment into the long-term competitiveness of your SMT production.

JUKI\'s philosophy is to offer the customer the best solution with highest performance at lowest yearly cost or as JUKI calls it the LOWEST COST OF OWNERSHIP

• long-term protection of investment
• lowest downtime caused by breakdowns, changeovers, maintenance etc.
• least possible defective goods
• quick changeover, easy to operate, program and maintain
• optimized placement process for full range of components,
• full control and traceability of the placement process

KE-2050R High-Speed Chip Shooter Placement head: Quadruple head with multi-laser alignment Placement rate: 13,200 cph Component range: 0201 (inch) 11 x 26.5mm or 20 x 20mm Placement accuracy: ±50µm (3 Sigma

KE-2060R High-speed fine pitch assembler Placement head: Quadruple head with multi-nozzle laser alignment and multi-nozzle vision centering (MNVC - optional) 1 high-precision placement head with vision and laser alignment Placement rate: 12,500 cph  (IPC 9850) 3,400 cph Fine-Pitch  (with MNVC) Component range: 0201 (inch) High-precision head: up to 75 x 75mm or 50 x 150mm Placement accuracy: High-precision head (vision centering): ±30µm (3 Sigma) Laser alignment: ±50µm (3 Sigma)

KE- 2070 High speed chip-shooter Placement head: One multi-nozzle laser head (6 nozzles) Placement rate: 16,000 CPH: chip (laser centering / IPC 9850) Component range: From 0402 (01005) to 33.5mm square components

KE-2080 High speed flexible mounter Placement head: Six nozzle head with laser alignment one high precision placement head Placement rate: 15,400 CPH: chip (laser centering / IPC 9850) Component range: From 0402 (01005) to 74mm square components or 50x150mm

• 2070: 16,000 cph (assuming M size PWB and 6mm comp. height)
• 2080: 15,400 cph (assuming M size PWB and 12mm comp. height)

• 50µm for laser components
• 30µm for vision components
• New accuracy specification (Cpk ≥ 1, old was “3 sigma”)
• About 25% more accurate vs. 2050/2060 models
• Magnascale resolution improved to 1?m

• 2070: 6 nozzles in 1 laser head
• 2080: 6 laser nozzles + 1 vision only head (similar concept to KE-720)
• Reduces need to change nozzles because machine can have a wider variety of nozzles from the start of production
• Heads use air cylinder to hold up vs. springs for all previous models – better for Z motor (allows smaller size)

• CyberOptics LNC-60
• “Tangential Line Centering™” is roughly 2.5 times the accuracy of MNLA
• Max. component size 33.5mm (vs. 20mm for 2050/2060 MNLA)
• Min. component size 01005 (standard)
• More compact (12mm shorter), IEEE 1394 (aka Firewire) communications, integrated control board
• 25µm laser thickness at center
• 300 data points per measurement
• Better for clear LEDs
• Light source lasts 10x longer than older models